Building on 15 years of cloud services for the most advanced designs, Synopsys has collaborated with TSMC, Amazon Web Services, Microsoft Azure, and Arm to streamline the Synopsys Cloud Solution for TSMC VDE. “Today we are expanding our Open Innovation Platform® Alliance partnerships in EDA and IP to become an OIP Cloud Alliance partner. “Synopsys tools and IP are at the heart of innovations fueling the growth of high-end cloud infrastructure,” said Deirdre Hanford, co-general manager, Synopsys Design Group. Through our collaboration with TSMC, Arm, Microsoft and AWS, Cadence is leading the industry to shift to the cloud, providing the productivity, security, scalability and flexibility customers require to use TSMC design collateral effectively across companies and geographic regions.” “The Cadence Cloud-Hosted Design Solution is a production-proven, EDA-optimized cloud environment with active customer engagements, leveraging extensive experience hosting design environments for more than 100 customers. “Cadence unveiled the industry’s first broad cloud portfolio for semiconductor development earlier this year, and we’re continuing to expand it with the immediate availability of TSMC’s VDE in the Cadence Cloud-Hosted Design Solution,” said Dr. For more information on the Synopsys Cloud Solution, visit Company Quotes Additional detail regarding Cadence’s deployment of VDE is available at The Synopsys Cloud Solution, enabled for TSMC VDE, is available immediately in both Amazon Web Services and Microsoft Azure cloud environments. Cadence’s VDE collaboration with TSMC enables customers of any size using any process node to securely optimize design throughput using the scalability and flexibility of the cloud. The Cadence® Cloud-Hosted Design Solution is immediately available as a VDE Storefront with successful tapeouts completed. TSMC OIP VDE is available with the VDE Storefronts being handled directly by Cadence and Synopsys, respectively. “TSMC OIP VDE provides flexible, secure, and silicon-validated cloud-based design solutions to semiconductor customers, enabling them to optimize and scale their computing infrastructure, and ultimately accelerating time-to-market for next generation SoC designs.” TSMC is the first foundry to collaborate with design ecosystem partners and cloud providers to enable designs in the cloud,” said Cliff Hou, vice president of Technology Development at TSMC. “The cloud is pervasive and will fundamentally influence silicon design.
This tapeout, achieved in collaboration with Amazon Web Services, was accelerated by taking advantage of cloud scalability to 1000+ CPU cores.Īrm, a key TSMC IP Alliance partner, has collaborated with its EDA partners and TSMC, to ensure Arm’s ecosystem of silicon partners are able to immediately design-in-cloud including Arm’s latest processors and across all TSMC nodes through its most advanced 7nm node. Synopsys, a key TSMC IP Alliance, and VDE partner, has successfully taped out its high-speed DesignWare® PHY IP for PCI Express® 5.0 on TSMC’s advanced 7-nm process through the Synopsys® Cloud Solution enabled for TSMC OIP VDE using TSMC process models and rule decks. The SiFive implementation was done in the U.S. It contained its 64-bit multi-core RISC-V CPU, the Freedom Unleashed 540, which is capable of running a RISC-V Linux distribution and its applications via TSMC OIP VDE.
Microsoft and Cadence collaborated with SiFive, a TSMC IP Alliance partner, to tape out the first full SoC design in TSMC’s OIP VDE. To ensure low barriers to entry and high technical support levels, Cadence and Synopsys act as the focal point helping customers to set up VDE and providing first line support. In TSMC’s enablement of OIP VDE, both digital and custom design flows have been validated in the cloud, along with OIP design collateral-including process technology files, PDKs, foundation IP, and reference flows.
TSMC OIP VDE’s first implementations of digital RTL-to-GDSII and custom schematic capture-to-GDSII flows are via partnerships with TSMC’s inaugural Cloud Alliance partners, Amazon Web Services (AWS), Cadence, Microsoft Azure, and Synopsys. OIP VDE is the result of TSMC collaboration with TSMC OIP design ecosystem partners and leading cloud providers to deliver a complete systems-on-chip (SoCs) design environment in the cloud. – –TSMC (TWSE: 2330, NYSE: TSM) today announced the initial availability of its Open Innovation Platform® Virtual Design Environment (OIP VDE), which enables semiconductor customers to securely design in the cloud, leveraging TSMC OIP design infrastructures within the flexibility of cloud infrastructures.